Superior Throughput



Ultrafast pulsed lasers provide new opportunities in processing a wide range of materials. Considering the wide variety of processes in laser microprocessing NST customers focus on demanding throughput applications like:

  • Display: thin film patterning of touchscreen devices
  • Solar: R2R processing of flexible electronics
  • Semicon: microdrilling, grooving and dicing of wafers
  • Security: direct write of high precision ID features
  • Automotive: thin film ablation and micromachining
  • Medical: glass and plastic micromachining
  • Additive manufacturing: large area exposure systems & LIFT processing
  • Sensors: high precision part manufacturing
Figure 4_2.5 D Micromachining

Topography Switzerland in Stainless Steel by picosecond laser source

  • Dimension 108 x 65 mm
  • Resolution 1.750 dpi (14.5 um)
  • Scan speed 60 m/s
  • Pulse Repetition Rate 4.1 MHz (PicoBlade, JDSU_TimeBandwidth)
  • Processing speed 24 seconds per layer

Process development and execution by Bern University of Applied Sciences
Supported by FP7 project APPOLO


  • Single pass or multi pass raster scanning is an acceptable technique ¬†without any throughput penalty or compromise in quality.
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